IEEE Distinguished Lecturer講演会
IEEE EMC Society Sendai Chapter
Chair 嶺岸茂樹
IEEE EMC Society
Distinguished Lecturer講演会を開催致しますので奮ってご参加下さいますようお願いいたします．参加費は無料，事前申し込みは不要です．
主催: IEEE EMC Society Sendai Chapter
併催:伝送工学研究会（主査：松浦 祐司）
日時: 12月16日（月）15：00−16：30
場所: 東北大学大学院工学研究科 電子情報システム・応物系 南講義棟103講義室
http://www.eng.tohoku.ac.jp/map/?menu=campus&area=d&build=18
講演題目：Multiphysics Methods for the Development of Miniaturized
Passives with High Performance for 3-D RF Integrations
講演者：Wen-Yan Yin (Professor of Zhejiang University, IEEE Fellow)
Abstract of the Talk:
It is well-known that both reliability and
performance of present-day 3-D RF integrated circuits and their packages cannot
be completely understood or accurately predicted from electromagnetic
considerations alone. For example, the physical characteristics of high-density
interconnects and miniaturized RF passive as well as active devices are often
affected by heat conduction and mechanical stresses/deformations, in extreme
cases leading to electro-thermo-mechanical breakdown. Under such circumstances,
predictive simulations and designs must rely on multiphysics
computational approaches as opposed to electromagnetics- only methods. There
exist many challenges in developing computational algorithms for rapidly and
accurately analyzing electrothermal and electro-thermo-mechanical
phenomena in miniaturized 3-D RF passives with complex geometries and material
properties. For starters, most material parameters, such as permittivity,
permeability, electrical conductivity, thermal conductivity, and thermal
expansion coefficients are temperature dependent.
This talk will be focused on multiphysics method for the development of miniaturized
passives with high performance for 3-D RF integrations. Its outline is given as
follows:
1. Background: Motivation: multiphysics
methods provide many opportunities for all of us!
2. Experimental observation of temperature
effect on the performance degradation of interconnects & passives, and even
electro-thermal-mechanical breakdown events of active devices.
3. Hybrid time-domain finite element method
(FETD) and its algorithm realization.
4. Electro-thermo-mechanical responses of
various interconnects, RF passives and actives;
5. Conclusion.
Biography
of the Speaker:
Prof.
Wen-Yan Yin received his M.Sc. degree from Xidian
University in 1989 and Ph.D. degree from Xi'an Jiaotong
University in 1994. Prior to joining ZJU he worked in the Department of
Electronic Engineering, Northwestern Polytechnic University as an Associate
Professor from 1993 to 1996. He was a Research Fellow with the Department of
Electrical Engineering at Duisburg University, granted by the Alexander von Humblodt‐Stiftung of Germany from 1996 to
1998. Since December 1998 he has been with the MMIC Modeling and Packing Lab,
Department of ECE of National University of Singapore (NUS) as a Research
Fellow. In March 2002 he joined the Temasek
Laboratories of NUS, as a Research Scientist. From April 2005 to December 2008
he was with the School of Electronic Information and Electrical Engineering as
a Professor of Shanghai Jiao Tong University (SJTU). He was also the Director
of Centre for Microwave and RF Technologies (CMRFT) of SJTU.
Dr. Yin
has published more than 200 international journal articles including one
international book, 15 book chapters and more than eighty IEEE Papers. Two
invited chapters are published in the Encyclopedia of RF and Microwave
Engineering, John Wiley & Sons, Inc. He is an IEEE EMC Society
Distinguished Lecturer from 2011 to 2012, the Guest Editor of IEEE Trans. CPMT,
the Associate Editor of Int. J. Electron Networks, Devices and Fields, the
General Co‐Chair of IEEE EDAPS'2011, and the Editorial
Board Member of Inter. J. Microwave CAE. He received numerous technology and
best paper awards. IEEE Fellow.
問い合わせ: 陳 強 chenq @ ecei.tohoku.ac.jp